FibreTuff: Bone Replacement Filament
FibreTuff: Bone Replacement Filament
FibreTuff produces superior 3D printed bone models with high strength & radiopacity.
FibreTuff is comprised of FDA compliant advanced biomaterial compounds for producing 3D Printed parts in the medical industry. FibreTuff has already passed NAMSA Class I testing governing cytotoxicity and skin irritation, as well as USP Class VI testing for Class II, and eventually Class III 3D Printed medical devices and implants. FibreTuff’s strength is ideal for medical, dental, and veterinary pre-surgical models. Every inch of FibreTuff is produced under expert supervision at our medical grade extrusion facility.
Biocompatible: FibreTuff is biocompatible, meaning living tissue and bone will absorb and adhere to it.
Non Toxic: FibreTuff is non bioresorbable and does not dissolve or leech harmful compounds into the bloodstream.
Desktop FDM Compatible: FibreTuff II rivals PEEK in strength to weight ratio but prints at 230℃ making it compatible with most desktop FDM printers.
Using FibreTuff 3D Models for Orthotics:
FibreTuff provides superior anatomical bone models with Radiopacity for femurs, calcaneus, talus, metatarsal, skull cap, mandible, sacrum, etc.
Pre-surgical simulation, assessment, training & planning.
Practice drilling through bones using models 3d printed that match patient specific anatomy.
Practice securing implants in place, including exactly where and how deep to drill or cut bone with the proper insertion angle.
Improved surgical outcomes for patients.
Reduced operation times.
Increased effectiveness of medical/surgical education and training.
Ability to drill, saw, screw, machine, and laser cut.
Anatomical accuracy of model in respect to patient.
Realistic mechanical properties for cortical and inner bone.
A virtual reality simulator for orthopedic basic skills:
FibreTuff testing for medical use:
FibreTuff has passed Cytotoxicity and Skin irritation tests and USP Class VI testing for temporary implants performed by NAMSA a regulatory approved testing company for medical devices and implants.
FibreTuff biomaterials for anatomical models and medical devices:
The 3D Printed medical devices with FibreTuff show significant improvement in both chemical and thermal properties . FibreTuff can be 3D Printed into 70um to 100um porous filters with a wide processing window and no visible degradation of cellulose fibers when printed at recommended temperatures.
High Strength or Pliability: Our FibreTuff filaments can be produced in multiple formulations for applications requiring high impact or compression strength, or a high degree of flexibility.
Strong & Affordable: FibreTuff is a cost-effective alternative to high-performance materials such as PEEK and is recommended for high strength applications where FDA compliant ingredients are required. FibreTuff has high heat resistance and excellent strength to weight ratio. 3D printed parts have withstood 6,000psi. compressive strength.
Desktop FDM Compatible: While PEEK requires printing temperatures above 350℃, FibreTuff formulations will print at temps ranging from 210℃ to 260℃
Versatile: Temporary uses include mesh or sutures for surgical use, 3d printed casings for spinal stimulation devices, or even as a scaffold to help grow new bone.
Sterilization: FibreTuff parts utilize standard sterilization methods Autoclave and Gamma irradiation.
Radiopaque: FibreTuff is visible to X-Ray and MRI imaging which provides key advantages over both PEEK and metal implants. PEEK is invisible to radiology and the only way to examine an implant if a patient is experiencing discomfort due to potential fit issues is through surgery. Patients with metallic implants cannot undergo MRI scanning and metals leech toxic compounds into the body over time as well.
FibreTuff Material Displays High level of Radiopacity in Recent Tests
FibreTuff used in X ray and CT Scan at Toledo Clinic.
Coating FibreTuff: A range of options yield improved adhesion for better part strength as well as adhesion of specialized coatings.
Circuitry: FibreTuff’s adhesive properties support advanced printing technology for printing electronic circuits allow 3d printed circuits to be placed on or embedded into 3d printed parts. These circuits may contain sensors for monitoring environmental or mechanical conditions experienced by an implant or other device, which can help to monitor the health of both the patient and the device and to warn of possible problems. These sensors could measure temperature, pressure, motion and other factors that would send the information to a doctor. A sensor could also measure balance and equilibrium on a person that has orthopedic surgery or monitor a wound for infection by measuring temperature changes.
Post Processing: FibreTuff parts can be laser cut or machined; e.g. drilling, sawing, turning milling, etc., without the need for annealing. Hydrophobic ingredients also lower moisture uptake and reduce drying time.
FibreTuff compounds have a low specific gravity .99 - 1.04 based on ASTM D792-13 testing and water absorption < .24% based on ASTM D570-10.
The melt flow rate is approx. 15-20 grams per 10 min. per ASTM D1238-13.
For more information please call (800) 201-3249 or email: firstname.lastname@example.org
Nozzle Temperature: 220°C - 240°C with cooling fan off. Use .6mm nozzle if available.
Print Bed: Set to 95°C or higher.
Print Surface: We recommend sanded PEI sheets for best adhesion.
Build Chamber: Try to maintain an enclosure temp of 80°C
Print Speed: 40-55 mm/s with 0.25mm layer height, and retraction at 1.5
Infill: Set to triangular, cortical bone is 100% infill while inner bone should be around 95%
Drying: Once opened FibreTuff can absorb moisture and we recommend drying at at least 80°C for a few hours before using to improve performance.
DISCLAIMER: U.S. Patent No. 10,233,309. FibreTuff is a registered trademark. Not approved for orthopedic implants or any other long term medical uses. Sold as is. There are no representations or warranties, either expressed or implied, of merchantability, fitness for a specific purpose, or non-infringementof any intellectual property right.